X-ray inspection machine size measurement numerical calculation function, efficient and convenient, to meet the diverse needs of inspection
For manufacturing enterprises, quality inspection of products or workpieces plays a crucial role. The X-ray inspection system offers a diverse range of measurement functions, enabling precise calculations for hollows, radii, angles, areas, spacing, solder crawling heights, and more. High-resolution imagery captures critical areas in detail, providing reliable data that supports process improvements and stringent quality control.
Images provided include welding point spacing calculation, battery negative terminal length measurement, IGBT bubble calculation, welding point size measurement, sensor chip inner distance measurement, and diamond distance measurement. These examples demonstrate that the system is not only effective in routine geometric measurements but also capable of in-depth analysis of complex structures. With outstanding stability and repeatability, the equipment meets a variety of industrial testing requirements.
In practical applications, whether for precision manufacturing of electronic components or safety inspection of large parts, the X-ray inspection system delivers objective and accurate evaluations. Advanced image processing and intelligent algorithms ensure that measurement data is delivered in real time, enabling enterprises to enhance product quality and optimize production efficiency.
To more intuitively demonstrate the measurement capabilities of the X-ray inspection machine, the following specific case studies illustrate its performance in actual production.
Welding Point Spacing Calculation
Application Case Studies
In the electronics manufacturing industry, measuring the spacing of welding points is crucial. Spacing that is too narrow may lead to short circuits, while spacing that is too wide may affect circuit performance. Using the X-ray inspection machine, we can capture clear images of the welding points and use specialized software to calculate the distance between them, ensuring they meet design specifications.
Battery Negative Terminal Length Measurement
In battery manufacturing, the length of the negative terminal directly impacts performance and lifespan. With the X-ray inspection machine, companies can non-invasively measure the battery's negative terminal length, ensuring its accuracy and consistency to meet stringent production standards.
IGBT Bubble Calculation
In the semiconductor industry, bubble detection in IGBTs (Insulated Gate Bipolar Transistors) is key to quality control. Bubbles can lead to reduced performance or even device failure. The X-ray inspection machine can clearly display bubbles inside IGBTs and, through image processing technology, calculate the size and number of bubbles, helping companies identify issues promptly.
Welding Point Size Measurement
The size of welding points is directly related to welding strength and reliability. The X-ray inspection machine, through high-resolution imaging, can precisely measure welding point dimensions, providing companies with reliable quality data.
Sensor Chip Inner Distance Measurement
The precision of the internal spacing of sensor chips is crucial to product performance. The X-ray inspection machine can measure the spacing in key areas, ensuring that products meet design standards.
Diamond Distance Measurement
In high-end manufacturing sectors, such as diamond tool production, distance measurement demands extremely high precision. The X-ray inspection machine can deliver accurate measurement results, helping companies optimize production processes.
These case studies demonstrate the wide applicability of the X-ray inspection machine across various industries, providing comprehensive quality control measures to ensure that products meet high standards at every stage.
